HEATING DEVICE FOR MANUFACTURING SEMICONDUCTOR

摘要

A heating device for manufacturing semiconductor capable of uniformly heating a wafer or other materials to be treated, and in particular a heating device in a coater-developer used for heat-hardening of resin film for photolithography and for heat-calcining of low-dielectric constant insulating film, is provided. <??>A device of this invention comprises a ceramic holder 1 having a resistive heating element 2 embedded therein, which holds and heats a wafer 6 or another material to be treated; a cylindrical support member 4 which supports the ceramic holder 1; and a chamber 5 which houses these. The support member 4 and ceramic holder 1 are not hermetically sealed, or alternatively the atmospheres within the cylindrical support member 4 and within the chamber 5 are maintained to be substantially the same by adjusting the introduction and evacuation of gas. <IMAGE>