| 摘要 |
A semiconductor package has a substrate comprising a resin layer of an approximate planar plate, a die pad coupled at a top surface of a center area of the resin layer and having a printed photo imaging type protective layer thereon and a plurality of electrically conductive patterns, on which the photo imaging type protective layer and a thermosetting protective layer are printed in a consecutive order, formed at a periphery of the die pad. A semiconductor die is coupled to the photo imaging type protective layer on the die pad of the substrate by an adhesive. A plurality of conductive wires is used for electrically connecting the semiconductor die to the electrically conductive patterns. An encapsulant is used for covering the semiconductor die, the conductive wires and the surface of thermosetting protective layer on the electrically conductive patterns in order to protect them from the external environment. A plurality of contacts are coupled to the electrically conductive patterns of the substrate.
|
