发明名称 Memory structure with a ferroelectric capacitor
摘要 It is an object of the present invention to provide a fine memory cell structure preventing a reaction between an interlayer insulating film and a ferroelectric film and suitable for high integration. According to the invention, there is provided a structure in which a reaction barrier film 43 is interposed between a ferroelectric film 71 and an interlayer insulating film 32 and side walls of a diffusion barrier film 51 are not brought into direct contact with the ferroelectric film 71. Thereby, the reaction between the interlayer insulating film 32 and the ferroelectric film 71 can be restrained and exfoliation of the ferroelectric film 71 can be prevented.
申请公布号 US6822276(B1) 申请公布日期 2004.11.23
申请号 US19990391250 申请日期 1999.09.07
申请人 RENESAS TECHNOLOGY CORP. 发明人 TORII KAZUYOSHI;MIKI HIROSHI;FUJISAKI YOSHIHISA
分类号 H01L27/10;H01L21/02;H01L21/285;H01L21/8242;H01L21/8246;H01L27/105;H01L27/108;(IPC1-7):H01L27/108;H01L29/76;H01L29/94;H01L31/119 主分类号 H01L27/10
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