| 摘要 |
A dummy wafer and a method for manufacturing the same are provided to suppress foreign materials by preventing the peeling of stack structure using the dummy wafer having an unevenness surface. A body(11) of a dummy wafer is formed by an amorphous polysilicon material. A surface of the body of the dummy wafer includes an unevenness portion(13) formed by performing surface treatment using a Blast scheme which sprays fine blast materials at high speed. The body is formed by slicing thinly an amorphous ingot which is formed from liquid amorphous polysilicon. A height of the unevenness portion is 0.5-6 mum. Nitride and poly films are deposited initially on the surface of the body of the dummy wafer.
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