| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device that can prevent a drop of yield caused by defective positional deviation by suppressing an offset deviation to the minimum at the time of mounting a PTP (extremely thin semiconductor package), even when a ball screw is elongated or contracted due to a change in atmospheric temperature or the heat generated from the device itself. <P>SOLUTION: In this semiconductor manufacturing device, an image processing robot control device is provided with a standard position detecting means which picks up the image of a reference target 24 by means of a recognition camera 20 when X-Y robots 22a and 22b move from their starting positions to the position of the reference target 24, and calculates the position of the target 24 based on the image information, and a component transporting-time position detecting means which picks up the image of the reference target 24 by means of the camera 20 when the robots 22a and 22b start from their starting positions, pick up a semiconductor component by means of component mounting heads 19, and move to the position of the target 24, and detects the position of the target 24 based on the image information. Then the control device calculates the difference between the positional information acquired by means of the standard position detecting means and the positional information acquired by means of the component transporting-time position detecting means by comparing the two pieces of positional information with each other, and controls the moving amounts of the robots 22a and 22b to their target positions based on the information on the difference. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
