| 摘要 |
PROBLEM TO BE SOLVED: To provide a jig 18 to which a solder 30 does not adhere at the time of reflow soldering, and to provide a method for connecting an article. SOLUTION: The jig 18 touching the solder 30 at the time of reflow soldering is applied with DLC coating 20 at least to the part touching the solder 30. In the method for connecting an article using the jig 18 touching the solder 30 at the time of reflow soldering, DLC coating 20 is applied at least to the part touching the solder 30. COPYRIGHT: (C)2005,JPO&NCIPI
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