| 摘要 |
PROBLEM TO BE SOLVED: To provide a power amplifier module which suppresses the discharge of an electromagnetic wave radiated from the power amplifier module to the outside, and to provide a method for manufacturing the same. SOLUTION: Bumps 3 formed on the electrode of a flip-chip type MMIC 2 are adhered to the electrode part of a circuit board 4, and face down bonded. An organic material 5 having a low permittivity is filled in a gap between the flip-chip type MMIC 2 and the circuit board. This low permittivity organic material 5 is mixed with a filler having a particle size smaller than the particle size of the bump 3. The flip-chip type MMIC 2 is resin-sealed with a molding resin 6 mixed with ferrite. COPYRIGHT: (C)2005,JPO&NCIPI
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