| 摘要 |
PURPOSE: An anisotropic conductive adhesive, a mounting method using the adhesive, and an electrooptical device module and an electronic apparatus formed by using the mounting method are provided, to allow each mounting conductor to be adhered with a rapid curing velocity of an adhesive without heating, thereby allowing a pair of mounting components to be electrically connected certainly even if their coefficients of linear expansion are different each other. CONSTITUTION: The anisotropic conductive adhesive is cured by the reaction of a first material and a second material and contains a conductive particle, wherein the adhesive has a crushable microcapsule for filling the first material and the conductive particle, and the microcapsule is dispersed in the second material. Also the anisotropic conductive adhesive is cured by the reaction of a first material and a second material and contains a conductive particle, wherein a crushable microcapsule filling the first material is fixed to the conductive particle, and the conductive particle is dispersed in the second material. Preferably the first material is an amine, an imidazole, an acid anhydride, a phenol or their mixture; and the second material is an uncured epoxy resin. |
