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发明名称
半导体装置之制造方法
摘要
提供一种半导体装置之制造方法,此法可抑制离子注入于闸极之硼闸绝缘膜之穿透,且,可抑制通道区域之移动度之降低。半导体装置之制造方法,包含有:闸绝缘层形成工程,系在半导体基板之活性区域上形成闸绝缘层;氮导入工程,系藉活性氮从上述闸绝缘层表面侧导入氮;及退火处理工程,系在NO气体氛围气中施工退火处理,以便在导入有氮之闸绝缘层内,在表面侧保持氮之高浓度分布,并在同半导体基板之界面保持氮之低浓度分布。
申请公布号
TW200425300
申请公布日期
2004.11.16
申请号
TW093112231
申请日期
2004.04.30
申请人
富士通股份有限公司
发明人
堀充明
分类号
H01L21/28
主分类号
H01L21/28
代理机构
代理人
恽轶群;陈文郎
主权项
地址
日本
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