发明名称 Heat-dissipating silicone grease composition
摘要 To provide a highly reliable heat-dissipating silicone grease composition having stable thermoconductive properties over a long period of time, which does not exude oil, and which does not lead to contact defects.The heat-dissipating silicone grease composition, comprising:(A) 100 weight parts of an organopolysiloxane having a thixotropicity degree alpha of 1.03-1.50 and a viscosity at 25° C. of 100-1,000,000 mm<2>/s, and(B) 100-2,000 weight parts of a thermoconductive inorganic filler having an) average particle diameter of 0.1-100 micrometers.
申请公布号 US6818600(B2) 申请公布日期 2004.11.16
申请号 US20030409133 申请日期 2003.04.09
申请人 SHIN-ETSU CHEMICAL CO. LTD.;DENSO CORPORATION 发明人 YAMADA KUNIHIRO;UCHIDA OSAMU
分类号 C08K3/08;C08K3/22;C08K3/28;C10M107/50;C10M125/02;C10M125/04;C10M125/10;C10M125/26;C10M169/00;C10M169/02;C10N10/02;C10N10/04;C10N10/06;C10N10/16;C10N20/00;C10N20/06;C10N50/10;(IPC1-7):C01M107/50;C01M125/00 主分类号 C08K3/08
代理机构 代理人
主权项
地址