| 摘要 |
A plurality of core chips are arranged on a body of a semiconductor device, and a plurality of voltage down circuits are arranged on the outside of the core chips to lower a power supply voltage to a plurality of operating voltages of the core chips. In cases where the operating voltages differ from each other, each core chip is connected to the corresponding voltage down circuit. In cases where the operating voltages are the same as each other, one voltage down circuit corresponding to the same operating voltage is connected to a line surrounding the core chips, and the core chips are connected to the line. In cases where the operating voltage of one core chip is equal to the power supply voltage, the core chip is directly connected to a line of the power supply voltage. |
