| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, WIRING BOARD, AND FLEXIBLE WIRING BOARD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve developability and flexibility when an insulation layer of a flexible wiring board is formed. <P>SOLUTION: The photosensitive resin composition includes a photosensitive resin and a bifunctional urethane acrylate resin. The bifunctional urethane acrylate resin is obtained by reacting a compound having ≥2 alcoholic hydroxyl groups, a diisocyanate compound and (meth)acrylate having an alcoholic hydroxyl group. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
| 申请公布号 |
JP2004318047(A) |
申请公布日期 |
2004.11.11 |
| 申请号 |
JP20030295791 |
申请日期 |
2003.08.20 |
| 申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
YASUDA HIROYUKI;OKUGAWA YOSHITAKA |
| 分类号 |
G03F7/027;C08F290/06;G03F7/004;G03F7/038 |
主分类号 |
G03F7/027 |
| 代理机构 |
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