| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mounted component of versatility which can maintain sufficiently curing shrinkage force of adhesive agent after curing, and maintain stably connection reliability, and to provide the packaging method of the surface-mounted component and a packaging substrate. SOLUTION: In the surface-mounted component mounted on a substrate electrode 5 formed on a printed circuit board 4, a recessed trench 3 in which side view side does not carry out shedding at edge of a terminal electrode 2 with its side of the terminal electrode 2 closed at the end. By the recessed trench 3, a specified amount of adhesive agent component can interpose between the terminal electrode 2 of the surface mount component and the substrate electrode 5 of the printed circuit board 4. COPYRIGHT: (C)2005,JPO&NCIPI |
