| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having an arrangement for coping with a further increase in the number of external terminals, and to provide its manufacturing method. SOLUTION: The semiconductor device comprises a substrate frame 20 having an opening 22, a first major surface 36 provided with a plurality of first electrode pads 34, a first semiconductor chip 30 arranged in the opening, a first insulating film 40, a plurality of first wiring patterns 42, a first sealing part 44 exposing a part of the first wiring pattern, a plurality of first external terminals 47 provided on the first wiring pattern, a second semiconductor chip 60 having a plurality of second electrode pads 64 and arranged in the opening, a second insulating film 70 formed to expose a part of the second electrode pad, a plurality of second wiring patterns 72, a second sealing part 74 formed to expose a part of the second wiring pattern 72, and a plurality of second external terminals 77 provided on the second wiring pattern. COPYRIGHT: (C)2005,JPO&NCIPI
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