发明名称 |
Device and Process of laser processing with a laser head comprising a movable reflecting unit |
摘要 |
<p>A device (1) for laser processing has a cutting head (3) made movable relative to a placement surface (6) for the work-piece. The cutting head has an optical focusing system (5) though which the laser beam (2) is passed via a nozzle aperture (9), and at the same time, to the surface being worked (7) with an over-pressure gas exiting the nozzle (10). The cutting head (3) for positioning the laser beam (2) has a movable deflection unit (8) whose range of adjustment is set by the nozzle aperture (9). An independent claim is included for a working method for a laser processing device.</p> |
申请公布号 |
EP1475182(A1) |
申请公布日期 |
2004.11.10 |
申请号 |
EP20040007796 |
申请日期 |
2004.03.31 |
申请人 |
LPKF LASER & ELECTRONICS AG |
发明人 |
WENKE, STEPHAN |
分类号 |
B23K26/06;B23K26/08;B23K26/10;B23K26/14;B23K26/36;(IPC1-7):B23K26/14 |
主分类号 |
B23K26/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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