Multilayer printed circuit board and method for manufacturing same

摘要

A multilayer printed circuit board comprising a core substrate and a wiring layer and an insulating layer sequentially formed on one side of the core substrate has a thermal expansion coefficient in the XY direction of 2-20 ppm. The core material for the core substrate is selected among silicon, ceramic, glass, glass-epoxy composite material, and metal. The core substrate has a plurality of through holes which are filled with a conductive material for electrically connecting the front and back sides of the core substrate. A capacitor is formed on one side of the core substrate, and the capacitor is composed of an upper electrode that is the conductive material in the through hole and a lower electrode arranged opposite to the upper electrode via a dielectric layer.