发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which restrains substrate suspension effect without deteriorating integration degree, and its manufacturing method. SOLUTION: The semiconductor device has an SOI structure forming at least one MOSFET element in a silicon layer on an insulator. The MOSFET element consists of a source region, a drain region facing the source region, a body region formed between the source region and the drain region and a gate region formed near a surface of the body region and forms a conductive channel in the body region. It comprises a suction region which is in contact with the body region and the source region, has the same conductivity type as the body region and has higher concentration than that of the body region, In the manufacturing method, such a suction region is formed in a source region side by using an ion implantation method. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004311903(A) 申请公布日期 2004.11.04
申请号 JP20030106793 申请日期 2003.04.10
申请人 OKI ELECTRIC IND CO LTD 发明人 FUKUDA KOICHI
分类号 H01L21/265;H01L21/336;H01L27/01;H01L29/786;(IPC1-7):H01L29/786 主分类号 H01L21/265
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