RESIN COMPOSITION

摘要

Aresin composition, substratematerial, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermosetting resin and 0.1 - 65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient ( alpha 2) of up to 17 x 10<-3> Ä DEG C<-1>Ü over the temperature range from a temperature 10 DEG C higher than a glass transition temperature of the resin composition to a temperature 50 DEG C higher than the glass transition temperature of the resin composition.