摘要 |
The invention relates to a process of assembly of at least two silicon substrates. The method comprises: a step of placing in contact a first silicon substrate ( 9 ) with a second silicon substrate ( 10 ), the first and second substrates ( 9, 10 ) being substantially non-transparent for a wavelength lambda of laser radiation (R), and a step of illuminating the first silicon substrate ( 9 ) with a laser beam of wavelength lambda to create a fusion path ( 21 ), along the laser beam axis (A 1 -A 2 ), in the thickness of the first substrate ( 9 ) and in all or part of the thickness of the second substrate ( 10 ). The invention is applied to the sealing of cavities and of mechanical or electrical joints situated at the interface of two silicon substrates. |