发明名称 |
Polishing material and method of polishing therewith |
摘要 |
An abrasive obtained by curing raw materials containing at least (1) an organic polyisocyanate and at least one member selected from an organic polyol and an organic polyamine as matrix resin materials, and (2) a particle containing a predetermined amount of a hydroxyl group and/or colloidal silica and the like as an abrasive particle(s), by a polymerization reaction, the matrix resin being a resin having an urethane bond and/or an urea bond. The abrasive enables long-term continuous polishing of a workpiece to be polished without exerting a bad influence upon the environment.
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申请公布号 |
US2004209554(A1) |
申请公布日期 |
2004.10.21 |
申请号 |
US20040485297 |
申请日期 |
2004.01.30 |
申请人 |
TSUMAGARI AKIO;ISHIKAWA KAZUNORI;MIYAZAKI KAZUYA;ARAI KAZUHISA |
发明人 |
TSUMAGARI AKIO;ISHIKAWA KAZUNORI;MIYAZAKI KAZUYA;ARAI KAZUHISA |
分类号 |
B24B37/04;B24B37/24;B24B37/26;B24D3/28;C08G18/38;C08G18/48;C08K3/36;C09K3/14;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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