发明名称 Polishing material and method of polishing therewith
摘要 An abrasive obtained by curing raw materials containing at least (1) an organic polyisocyanate and at least one member selected from an organic polyol and an organic polyamine as matrix resin materials, and (2) a particle containing a predetermined amount of a hydroxyl group and/or colloidal silica and the like as an abrasive particle(s), by a polymerization reaction, the matrix resin being a resin having an urethane bond and/or an urea bond. The abrasive enables long-term continuous polishing of a workpiece to be polished without exerting a bad influence upon the environment.
申请公布号 US2004209554(A1) 申请公布日期 2004.10.21
申请号 US20040485297 申请日期 2004.01.30
申请人 TSUMAGARI AKIO;ISHIKAWA KAZUNORI;MIYAZAKI KAZUYA;ARAI KAZUHISA 发明人 TSUMAGARI AKIO;ISHIKAWA KAZUNORI;MIYAZAKI KAZUYA;ARAI KAZUHISA
分类号 B24B37/04;B24B37/24;B24B37/26;B24D3/28;C08G18/38;C08G18/48;C08K3/36;C09K3/14;(IPC1-7):B24B1/00 主分类号 B24B37/04
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