发明名称 |
Method for increasing the copper to superconductor ratio in a superconductor wire |
摘要 |
A method for producing a superconductor having a high copper to superconductor composition (Cu/SC) ratio by cross-sectional area. An assembly is prepared formed of one or more fine filaments of a superconductor composition or of a precursor component for a superconductor alloy composition, which filaments are embedded in a copper-based matrix. The assembly is electroplated with copper to increase the Cu/filament ratio in the resulting product, and thereby increase the said Cu/SC ratio to improve the stability of the final superconductor.
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申请公布号 |
US2004209779(A1) |
申请公布日期 |
2004.10.21 |
申请号 |
US20030690850 |
申请日期 |
2003.10.22 |
申请人 |
MARANCIK WILLIAM G.;HONG SEUNG |
发明人 |
MARANCIK WILLIAM G.;HONG SEUNG |
分类号 |
C21D9/00;C22F1/16;C25D5/50;C25D7/00;H01B1/00;H01B12/00;H01L39/24;(IPC1-7):H01B1/00 |
主分类号 |
C21D9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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