LAMINATE FOR WIRING BOARD AND ITS ETCHING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a laminate for a wiring board suitable for forming a fine pattern by reducing side etching in wet etching. SOLUTION: A laminate 10 for a wiring board is constituted of a lamiante insulating resin layer 9 for a wiring board for wet etching and a metallic foil layer 1. The insulating resin layer is formed of two or more polyimide resin layers constituted of a polyimide resin layer (L) whose etching speed in etching at 80°C is 1Im/min or less and a polyimide resin layer (H) whose etching speed is 5Im/min or more by using 30wt% potassium hydroxide water solution to which ethylenediamine 11wt% and ethyleneglycol 22wt% are added as etching liquid. The polyimide resin layer (L) is arranged only in the layer brought into contact with the metallic foil layer, and the thickness is 5Im or more. COPYRIGHT: (C)2005,JPO&NCIPI