发明名称 |
Substrate inspecting method and substrate inspecting apparatus using the method |
摘要 |
Inspection a is executed between a step B of mounting a chip component by a high-speed mounter and a step C of mounting a odd-shaped component by a odd-shape mounter. The inspection a executes not only mounted component inspection for determining a mounted state of a chip component mounted in the preceding step but also component fly inspection for determining whether a chip component is flown to a position where a odd-shaped component is mounted in the next step C. It is possible to execute the component fly inspection in accordance with a condition corresponding to the situation of an actual spot such as a case in which it is detected that a component is missing in mounted component inspection or a case in which the replacement date of an attracting nozzle in a high-speed mounter is approaching.
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申请公布号 |
US2004208353(A1) |
申请公布日期 |
2004.10.21 |
申请号 |
US20040786468 |
申请日期 |
2004.02.26 |
申请人 |
OMRON CORPORATION |
发明人 |
MURAKAMI KIYOSHI |
分类号 |
H05K13/08;G01N21/956;G01R31/28;G01R31/309;(IPC1-7):G06K9/00 |
主分类号 |
H05K13/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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