发明名称 |
SURFACE RELIEF STRUCTURES FOR JOINING AND ADHESION |
摘要 |
A solid substrate comprising a first major surface and a second major surface juxtaposed from and parallel or substantially parallel to the first major surface, wherein the substrate has a plurality of surface relief structures located on the substrate between the first major surface and second major surface, and further wherein the substrate has at least one channel extending through the substrate between the first and second major surfaces. |
申请公布号 |
WO03078304(A3) |
申请公布日期 |
2004.10.21 |
申请号 |
WO2003US08117 |
申请日期 |
2003.03.17 |
申请人 |
PHOTON-X, INC. |
发明人 |
GAO, RENYUAN;GARITO, ANTHONY, F.;BITTING, DONALD;CHANG, JOSEPH;TAKAYAMA, KAZUYA |
分类号 |
B29C37/00;B29C65/00;B81B1/00;B81C1/00;G02B6/12;G02B6/122;G02B6/138;G02B6/36 |
主分类号 |
B29C37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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