| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board for high density mounting having the small land diameter of an outer layer in the multilayer printed circuit board used widely for a variety of electronic devices. SOLUTION: A film-like insulating resin is laminated on an insulating board 3 for an inner layer having a conduction pit filled up with a conductor pattern 2 and conductive paste for the inner layer. After an interstitial via hole 5 is formed by exposure and development, a photographic via 6 is formed for electrically connecting inside and outside layers by metal plating, etc. Thereafter, a conductor pattern 7 for the outer layer is formed on the metal layer of the surface, and the multilayer printed circuit board 8 for the high density mounting is manufactured. COPYRIGHT: (C)2005,JPO&NCIPI |
