BASE FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD, POLYIMIDE FILM USABLE FOR CARRIER TAPE FOR TAB

摘要

PROBLEM TO BE SOLVED: To provide a polyimide composition and a polyimide film each having excellent properties such as low thermal expansion, low moisture absorption and low hygroscopic swelling. SOLUTION: The new polyimide resin composition having≤1.6% moisture absorption and≤15 ppm hygroscopic swelling factor is produced by dewatering cyclization of a polyamic acid copolymer represented by formula (1) [wherein R1is a divalent organic group selected from formulas (2); R2is one or more kinds of divalent organic group; R3is one or more kinds of tetravalent organic group; and, in formulas (2), R4is methyl, Cl, Br, F or methoxy]. COPYRIGHT: (C)2005,JPO&NCIPI