| 摘要 |
A method of machining a glass substrate using a laser, in which a low-permittivity, low-dielectric-loss glass substrate, capable of coping with mass production, is made applicable as the substrate of a high-frequency circuit intended in particular for microwave and millimeter-wave bands. For that purpose, a glass substrate is provided in which the amount of air bubbles in glass is arbitrarily controlled to improve the workability of the substrate. Then, the glass substrate is machined by being irradiated with a pulsed laser a plurality of times, thereby improving the machining shape of the glass substrate. Since glass substrates which are typically difficult to machine can be easily applied to the fabrication of high-frequency circuits, it becomes possible to supply high-performance circuits and apparatuses widely to the public.
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