PHOTOSENSITIVE POLYIMIDE PRECURSOR, PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT USING THE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive polyimide precursor which can form a polyimide film having reduced thermal expansiveness and residual stress, excellent adhesion to a base, increased breaking strength and elongation at break, furthermore reduces the warpage caused in a silicon wafer when the film is formed on the silicon wafer, and a photosensitive polyimide resin composition.

SOLUTION: The photosensitive polyimide precursor has a repeating unit formed of a polycondensation product of a tetracarboxylic acid or its acid anhydride and a diamine in the main chain and actinic radiation sensitive groups at its both terminals. The tetracarboxylic acid or its acid anhydride contains 70-100 mol% aromatic tetracarboxylic acid or its acid anhydride having a rigid structure and the diamine contains 70-100 mol% aromatic diamine having a rigid structure.

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