| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for bonding substrates together, with which accurate positioning of two substrates bonded together with a sealant is quickly and certainly carried out. SOLUTION: The method for bonding the substrates together is provided with bonding together of two substrates with the sealant, determining positional deviation between the two substrates of the substrates bonded together and correcting the positional deviation between the two substrates by moving at least one out of the two substrates based on a corrected distance obtained by multiplying the positional deviation by a correction coefficient. COPYRIGHT: (C)2005,JPO&NCIPI
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