发明名称 EQUIPMENT AND METHOD FOR SUBSTRATE PROCESSING
摘要 PROBLEM TO BE SOLVED: To maintain the pressure in a treatment vessel within a specified pressure range by adjusting the pressure easily and surely without depending on temperature control, and to improve the treatment performance. SOLUTION: Treatment vessels 30A, 30B in which treatment of a wafer W is performed, a steam generator 41 for supplying steam to the vessels 30A, 30B, main feed conduits 40 (40A, 40B) which connect the generator 41 with the vessels 30A, 30B, respectively, and supply switching means 60 (60A, 60B) interposed in the main feed conduits 40 (40A, 40B) are installed. Steam discharge conduits 70 (70A, 70B) are connected with a part between the supply switching means 60 (60A, 60B) in the main feed conduits 40 (40A, 40B) and the steam generator 41, or with the generator 41. A motor valve 50 is interposed in the steam discharge conduits 70 (70A, 70B). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004288766(A) 申请公布日期 2004.10.14
申请号 JP20030077148 申请日期 2003.03.20
申请人 TOKYO ELECTRON LTD 发明人 ITO KIKO;SATAKE KEIGO
分类号 G03F7/42;H01L21/027;H01L21/304;(IPC1-7):H01L21/304 主分类号 G03F7/42
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