| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg excellent in dielectric property, laser-processing property and flame retardant property, and a printed circuit board. SOLUTION: The prepreg is obtained by impregnating a resin composition containing a cyanate resin and/or its prepolymer and an inorganic filler with a nonwoven fabric constituted by an organic fiber, and exhibits≤50 ppm/°C thermal expansion coefficient in surface direction at or lower than a glass transition point of a cured material obtained by curing the prepreg. Also, the printed circuit board is obtained by laminating a metal foil on the prepreg and heating/compressing for forming. COPYRIGHT: (C)2005,JPO&NCIPI
|
