| 摘要 |
PROBLEM TO BE SOLVED: To enable to prevent malfunction such as cracks which occur in an interface between a substrate and a conductor wiring without increasing a resistance value of the conductor wiring. SOLUTION: A wiring pattern 7 is formed at a green sheet substrate 5 by using a conductor paste 6 formed by mixing silver oxide into conductor powder, the green sheet substrate 5 is baked at a temperature higher than the reduction temperature of the silver oxide, a wiring layer composed of the conductor body containing silver reduced from the silver oxide is formed at the green sheet substrate 5, so that, when the green sheet substrate 5 is baked, a burning shrinkage rate is made to be matched with that of the green sheet substrate 5 by the silver oxide, and after calcination, the silver oxide is made to be reduced and transformed into silver to prevent increase of the wiring resistance. COPYRIGHT: (C)2005,JPO&NCIPI
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