发明名称 SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus for manufacturing a semiconductor thin film at a low cost, particularly excellent in the uniformity of the film thickness and composition ratio. SOLUTION: A heat conductor is installed between a reaction vessel and a temperature regulator or between the board facing a substrate-provided board and the temperature regulator. In other cases, the thickness of the wall in the region where the reaction vessel is near the temperature regulator is adjusted or the thickness of the board facing a substrate-provided board is adjusted. By using this design, the temperature distribution inside the reaction vessel is properly controlled for the acquisition of a semiconductor thin film excellent in film thickness and in composition ratio. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004281836(A) 申请公布日期 2004.10.07
申请号 JP20030072909 申请日期 2003.03.18
申请人 HITACHI LTD;HITACHI CABLE LTD 发明人 HASEGAWA MITSURU;MIYAUCHI AKIHIRO;WATANABE KAZUTOSHI;MEGURO TAKESHI
分类号 C23C16/46;C30B25/10;C30B25/16;H01L21/205;(IPC1-7):H01L21/205 主分类号 C23C16/46
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