Multilayer circuit board e.g. for electrical and computer technology especially computer back-planes, uses metallization consisting of through-boring passing through circuit board

摘要

A multi-layer circuit board has at least two conductor path layers (5A,D) in which adjacent conductor path layers are separated by an insulation layer. At least one metallization is used in which the metallization consists of a through boring (10) extending through the circuit board and which, on its wall, carries a metal layer (11) which inter- connects the conductor paths in different conductor path layers, where the through boring carries a metal layer on its lateral/cylindrical wall. The through boring has a metal layer the peripheral surface of which is broken through. An independent claim is included for a method of manufacturing a multi-layer circuit board.