| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a Hall element such as a GaAs Hall element or the like at a low price by using a resin such as a silicon resin or the like as a package material. SOLUTION: In the Hall element, a Hall element chip 1 is die-bonded on a lead frame 5, and an inner lead part 6a of a lead 6 of the lead frame 5 is connected to an electrode 3 of the Hall element chip 1 by a bonding wire 2. A thermosetting resin such as a silicone resin 7, or the like is coated on the whole of the bonding wire 2 and the inner lead part 6a for sealing, to form a package 8. COPYRIGHT: (C)2005,JPO&NCIPI
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