| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To form an insulating layer for insulating a solid-state imaging element from leads in a uniform thickness. <P>SOLUTION: The solid-state imaging element includes a plurality of pads for bonding the leads on a semiconductor substrate on the same surface as the imaging element provided on the semiconductor substrate. The semiconductor light emitting element further includes the leads drawn out at the rear of the imaging element along the side face of the semiconductor substrate from the pads. Many fine solid members harder than the leads are interposed between the leads and the semiconductor substrate. This solid member is fixed by being crimped to the leads. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
