| 摘要 |
PROBLEM TO BE SOLVED: To provide a tray for a small electronic component in which warping generated in injection molding using a mold can be prevented finely and warping generated by heating in use can be prevented effectively only by adding a simple shape in a transportation chip tray or a baking tray. SOLUTION: In the transportation chip tray or the baking tray, an upper surface part is provided on a seat surface part protrusively and many hollow parts to store a chip is provided on the upper surface and a dint is formed on the back face of the seat surface and a fine groove is also formed in the circumference of the bottom face of the dint along the inner surface of the circumference. Since only by adding a very simple structure that the fine groove is formed in the circumference of the bottom face of the dint formed on the backside, the warping generated in injection molding using the mold can be prevented finely, the warping in use can be prevented effectively, and in the case of baking use, a precise tray, which can be heated uniformly, can be provided. COPYRIGHT: (C)2005,JPO&NCIPI
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