发明名称 Integrated circuit
摘要 <p>A lamination of metal wire layers forms an electromagnetic isolation structure. The metal wire layers are connected with each other by vias, so that a metal fence having a laminated structure is formed. The metal fence is provided so as to surround an element (e.g. a spiral inductor) that generates an electromagnetic field in an integrated circuit. The metal wire satisfies d‰ »/8, WF‰¥5´, and L‰ »/20, where ´ is a skin depth of an electromagnetic wave, c is a velocity of light, f is an operating frequency of the integrated circuit, d is a lateral-direction size of a metal-fence region, WF is a surrounding-line width of the metal fence, L is an interval between the vias, and »=c/f is a wavelength of a signal. With this arrangement, it is possible to decrease electromagnetic coupling noises and coupling noises caused via the substrate.</p>
申请公布号 EP1465255(A2) 申请公布日期 2004.10.06
申请号 EP20040252013 申请日期 2004.04.02
申请人 SHARP KABUSHIKI KAISHA 发明人 ADAN, ALBERTO O
分类号 H01L23/52;H01L21/3205;H01L21/822;H01L23/522;H01L23/552;H01L23/58;H01L27/04;(IPC1-7):H01L23/66 主分类号 H01L23/52
代理机构 代理人
主权项
地址