发明名称 |
Bonding system and method |
摘要 |
In a plate bonding system for bonding first and second substrate discs (or other plates) with adhesive, there are provided a first section for bringing the first and second substrate discs closer to each other with the interposition of adhesive, and a second section for producing an electric field in the interspace between the first and second substrate discs. The second section produces the field and thereby deforms the adhesive into a tapered shape to minimize the initial contact area and thereby prevent voids from being involved in the adhesive. |
申请公布号 |
US6800168(B2) |
申请公布日期 |
2004.10.05 |
申请号 |
US20020150922 |
申请日期 |
2002.05.21 |
申请人 |
ORIGIN ELECTRIC COMPANY, LIMITED |
发明人 |
YAMAGUCHI KOJI;NAKAMURA MASAHIRO;KOTOYORI MASAHIKO;SHINOHARA SHINICHI;KOBAYASHI HIDEO |
分类号 |
B29C65/52;G11B7/26;(IPC1-7):G11B7/26 |
主分类号 |
B29C65/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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