发明名称 |
Interposer with signal and power supply through vias |
摘要 |
A planar thin film multi-layer capacitor having a high dielectric constant with a plurality of conductive through vias and a plurality of pairs of conductive through vias having a low dielectric constant and operating in a transverse electromagnetic wave mode for high frequency signals on the pairs of vias. Vias coupled to the capacitor are arranged to propagate alternate polarity. The interposer is adapted for coupling directly to a die.
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申请公布号 |
US2004188826(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
US20030403312 |
申请日期 |
2003.03.31 |
申请人 |
PALANDUZ CENGIZ A.;HOLMBERG NICHOLAS;ZHONG DONG |
发明人 |
PALANDUZ CENGIZ A.;HOLMBERG NICHOLAS;ZHONG DONG |
分类号 |
H01L23/498;H01L23/50;H01L23/66;H05K1/11;H05K1/14;H05K1/16;H05K3/46;(IPC1-7):H01L23/053 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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