METHOD FOR TESTING SEMICONDUCTOR DEVICE TO PRECISELY TEST ELECTRICAL CHARACTERISTIC BEFORE ASSEMBLY PROCESS

摘要

PURPOSE: A method for testing a semiconductor device is provided to test an electrical characteristic of a semiconductor device formed in each of a plurality of semiconductor chips by testing an electrical characteristic before an assembly process is performed. CONSTITUTION: A semiconductor wafer having a semiconductor device(20) is positioned on the surface of a sheet-type member. The semiconductor wafer is cut into a plurality of semiconductor chips(28). While the plurality of semiconductor chips are positioned on the surface, the electrical characteristic of the semiconductor device is tested.