发明名称 SURFACE TREATMENT DEVICE AND SURFACE TREATMENT METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a surface treatment device and a surface treatment method in which the entire surface of a work is subjected to uniform surface treatment even when the work is a large substrate or the like, and losses of the high frequency power are minimized. <P>SOLUTION: The surface treatment device comprises an anode electrode part 13, a work moving unit 20 to expose excited active species of a plasma discharge area 44 to be generated between the anode electrode part 13 and a cathode electrode part 15 to a surface 31 of a work 30. The cathode electrode part 15 has a opposing electrode part 40 which faces the anode electrode part 13 to form the plasma discharge area 44, and a high frequency AC power path forming part 41 which is continuous to the opposing electrode part 40 to form the path of the high frequency AC power from the anode electrode part 13 to a ground of an AC power source via the cathode electrode part 15. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004269983(A) 申请公布日期 2004.09.30
申请号 JP20030063784 申请日期 2003.03.10
申请人 SEIKO EPSON CORP 发明人 ASUKE SHINTARO
分类号 H05H1/24;B01J19/08;C23F4/00;G02F1/13;G02F1/1333;H01L21/3065;H05H1/46 主分类号 H05H1/24
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