UV-CURED HOT-MELT ADHESIVE

摘要

The inventive composition contains at least one polyacrylate that can be melted and cross-linked using UV light, optional additives and is characterised by an oligomer compound comprising at least one functional gro up that can be cross-linked using UV, said compound having a viscosity of betwe en 0.1 and 20 Pa.s at 25 ~C. The invention also relates to the use of the composition as a UV cross-linked hot-melt adhesive and to a method for producing a substrate that is provided with the composition. The composition can be used at a lower temperature than previous conventional hot-melt adhesives.