发明名称 POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing device for adjusting a pressing-down state of a polishing tape to a polishing object material. SOLUTION: This polishing device polishes a plane part of the plate-like polishing object material W arranged on a polishing table 6 by the polishing tape T installed in a polishing device body. The polishing device body includes: a rotatably driving cylindrical rotary drum 3; a tape reel 41 wound with the polishing tape arranged together in the rotary drum; a winding reel 42 for winding the polishing tape delivered from the tape reel; and the polishing tape. The rotary drum has an outer peripheral surface having the shaft directional length not less than the length for crossing a surface of the polishing object material, has a filament part 100 composed of an elastic body on the outer peripheral surface, and has a slit 32 extending in the shaft direction. The polishing tape from the tape reel is extracted after passing through the slit, and is wound on the winding reel by passing through the slit again so as to cover a filament part surface. The polishing table includes a slide mechanism 7 for sliding the polishing table to the rotary drum. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004268179(A) 申请公布日期 2004.09.30
申请号 JP20030060528 申请日期 2003.03.06
申请人 NIHON MICRO COATING CO LTD 发明人 OI HISATOMO;OSAWA KAZUNARI
分类号 B24B21/00;(IPC1-7):B24B21/00 主分类号 B24B21/00
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