| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting an electronic component and an electronic component mounting structure of superior reliability to thermal fatigue, and to provide an adhesive material for mounting an electronic component. SOLUTION: In the method for mounting an electronic component in which an electronic component 1 with a connecting electrode 4 formed on its side face, is mounted on a substrate 5 by solder-joining, a solder is supplied to a circuit electrode 6 of the substrate 5, and an adhesive material 8 containing a filler 9 whose maximum size is 30μm or more, is applied to an electronic component mounting position, and then the electronic component 1 is mounted. By this, a bonding part 18 where the adhesive material is hardened between the electronic component 1 and the substrate, and a solder coupling part 17 where the connecting electrode 4 is coupled to the circuit electrode 6 by soldering under a condition where the electronic component 1 is separated from the substrate 5 by a filler 9, are formed, so that stand off between a bottom surface of the electronic component 1 and a top surface of the substrate 5 is secured. Reliability to thermal fatigue is improved by lowering a stress level at the time of a heat cycle. COPYRIGHT: (C)2004,JPO&NCIPI
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