摘要 |
The invention relates to a method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate. It comprising creating a trench in the first surface, and establishing an insulating enclosure entirely separating a portion of said substrate, defined by said trench. It also relates to a product usable as a starting substrate for the manufacture of micro-electronic and/or micro-mechanic devices, comprising a flat substrate of a semi-conducting or conducting material, and having a first and a second surface and at least one electrically conducting member extending through said substrate. The electrically conducting member is insulated from surrounding material of the flat substrate by a finite layer of an insulating material, and comprises the same material as the substrate, i.e. it is made from the wafer material. |
申请人 |
SILEX MICROSYSTEMS AB;KAELVESTEN, EDVARD;EBEFORS, THORBJOERN;SVEDIN, NIKLAS;RANGSTEN, PELLE;HUHTAOJA, TOMMY |
发明人 |
KAELVESTEN, EDVARD;EBEFORS, THORBJOERN;SVEDIN, NIKLAS;RANGSTEN, PELLE;HUHTAOJA, TOMMY |