| 摘要 |
PROBLEM TO BE SOLVED: To increase the parts, such as ICs, that are contained in an optical semiconductor device, to integrate the device and impart multiple functions to the device, and to increase the HF transmission characteristics and optical transmission characteristics of the device. SOLUTION: The optical semiconductor device includes a flat plate-shaped metal base 1 in which a through-hole 1a is formed, a metal lid 3 having its lower ends joined to the upper principal surface of the base 1, a translucent member 4 joined to the lid 3, an input/output terminal 5 joined to the lower principal surface of the base 1, and an optical semiconductor element 2 placed on the upper surface of the input/output terminal 5. The input/output terminal 5 includes an electrode pad 5c formed around the optical semiconductor element 2 on the upper surface of rectangular parallel piped dielectric, and a step 5a formed between the lower surface of the terminal 5 and a one side face of the terminal 5, and further a wiring conductor 5b formed on the side surface 5e of the step 5a and electrically connected to the electrode pad 5c through an internal wiring 5d. COPYRIGHT: (C)2004,JPO&NCIPI
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