| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for carrying a wafer in which the wafer is held tightly on organic polymer after the surface thereof is polished, especially when the polished wafer is thin, so that an element on the surface is not broken and the wafer is protected against fracture and/or deformation. SOLUTION: After a silicon wafer is polished while being held tightly on a substrate, e.g. a hard plate and/or a resilient carrier (backing material) and/or a wafer, using a wafer fixing agent containing a compound having liquid crystal properties and after or before the processed surface is cleaned, an organic polymer film is pasted to the polished surface, the substrate is heated at a temperature not lower than the melting point of the compound having liquid crystal properties, the wafer pasted with the organic polymer film is removed together with the organic polymer film and then transferred to a different place. COPYRIGHT: (C)2004,JPO&NCIPI |
