发明名称 WIRING BOARD, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wiring board in which the reliability of electrode connection is raised so as to prevent the occurrence of short-circuiting by filling in a conductive material in holes in a desired section and an insulating material in the other holes by using an anodically oxidized film. SOLUTION: This wiring board 10 is provided with a substrate composed of a porous metal oxide film 11 in which many through holes 12 are formed, a conductive material 13 filled in the through holes 12 formed at the positions at which the electrodes of the substrate are disposed, and an insulating material 14 filled in the other through holes 12 than the through holes 12 in which the conductive material 13 is filled in. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004273480(A) 申请公布日期 2004.09.30
申请号 JP20030057950 申请日期 2003.03.05
申请人 SONY CORP 发明人 IWABUCHI TOSHIAKI
分类号 H05K1/11;H05K3/40;(IPC1-7):H05K1/11 主分类号 H05K1/11
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