发明名称 |
Heat sink with visible logo |
摘要 |
A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or fins being arranged in a predetermined pattern. The pins at least partially frame thermally conductive projections extending substantially perpendicular from said base which forming a discernable logo having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo performs cooling of the components within a package.
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申请公布号 |
US2004190256(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
US20030396908 |
申请日期 |
2003.03.25 |
申请人 |
JDS UNIPHASE CORPORATION |
发明人 |
GENOVA RONALD R.;STACKHOUSE DUANE S. |
分类号 |
H01L23/36;H01L23/367;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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