发明名称 Heat sink with visible logo
摘要 A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or fins being arranged in a predetermined pattern. The pins at least partially frame thermally conductive projections extending substantially perpendicular from said base which forming a discernable logo having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo performs cooling of the components within a package.
申请公布号 US2004190256(A1) 申请公布日期 2004.09.30
申请号 US20030396908 申请日期 2003.03.25
申请人 JDS UNIPHASE CORPORATION 发明人 GENOVA RONALD R.;STACKHOUSE DUANE S.
分类号 H01L23/36;H01L23/367;(IPC1-7):H05K7/20 主分类号 H01L23/36
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